3-Dimensional Circuitry Moulded Interconnection Devices

LDS (Laser Direct Structuring) 3D conformal circuitry and interconnection devices for inter-structural requirements.

Due to the high market demands for conformal circuitry and interconnection devices for inter-structural requirements, conveniences, and stable performance hence LDS (Laser Direct Structuring) was developed. The technology can be widely used in the mobile communications, handheld internet devices, precision instruments, medical equipment, automotive, aviation and many other industries. It effectively reduces the product size and improves reliability and support to many more innovation products.

Applications for Radio Frequency

Electronic communication products, such as cell phone antennas, GPS plastic modules

Military antenna for radar seeking system

Guiding Missile Antenna

Applications for Non Radio Frequency

Press Plug, Lithium Battery Structure

Large Plastic parts for Automotive, Aviation, Car Carriages

Electronic Medical Products

Robotic products

Environmental Friendly Lighting Products, Conductive Plastic

LDS (Laser Direct Structuring) is a 3 dimensional (conformal) circuitry production technology. The process of this technology is by inducing laser on injection molded materials to activate the metal compound to form a high precision interconnection circuitry structure.

Tontop innovated and optimized the LDS basis production process by integrating multi-dimensional motion control system, Laser engraving technology and scientific materials to become the world’s leading TP-LDS system production provider. With the innovated technology developed by Tontop Technology, high stability and mature technology, we have become the strongest domestic supplier for 3 dimensional precision circuitry.

We welcome OEM, ODM and manufacturers to contact us to discuss on co-operation and applications of LDS to domestic and industrial products.

3-Dimensional Circuitry Moulded Interconnection Devices